Browsing by Author "Fleshman, Collin"
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The fractal nature analysis by applying grain formations of SAC305/OSP Cu and SAC305-0.05Ni/OSP Cu solder joints for microelectronic packaging
Mitić, Vojislav V.; Fleshman, Collin; Duh, Jenq-Gong; Ilić, Ivana D.; Lazović, Goran (World Scientific Pub Co Pte Ltd, 2021)