A simple ball milling/thermal treatment procedure was applied to obtain fine thermistor powders. Three different powder compositions were analyzed–Cu0.2Ni0.5Zn1.0Mn1.3O4, Cu0.25Ni0.5Zn1.0Mn1.25O4 and Cu0.4Ni0.5Mn2.1O4. XRD analysis showed that all three powder compositions had a cubic spinel structure. Correlation between the sintering temperature, structure and resulting electrical properties was analyzed on bulk samples. Thick film pastes were composed and segmented thick film thermistors were screen printed on alumina, dried and fired. SEM analysis revealed a typical dendrite structure with small grains and a developed surface area. Thick film sheet resistance was measured on a test matrix and the resistance decreased with increasing Cu content. The temperature dependence of sample resistance was measured in a climatic chamber enabling calculation of the material constant and activation energy. Aging of the obtained segmented thermistors was analyzed and the resistivity drift was 0....23% for the Cu0.2Ni0.5Zn1.0Mn1.3O4 NTC thick film thermistor confirming greater stability of thermistors containing Zn and Cu that in combination with the determined good thermistor characteristics make them good candidates for temperature and heat loss sensor applications.
Keywords:
thick film thermistor / NTC ceramic material / ball milling / electrical properties / ageing
Source:
Materials Science and Engineering: B, 2013, 178, 3, 202-210
TY - JOUR
AU - Aleksić, Obrad S.
AU - Nikolić, Maria Vesna
AU - Luković, Miloljub D.
AU - Nikolić, N.
AU - Radojčić, B. M.
AU - Radovanović, Milan
AU - Đurić, Zorka Ž.
AU - Mitrić, Miodrag
AU - Nikolić, Pantelija M.
PY - 2013
UR - https://dais.sanu.ac.rs/123456789/339
AB - A simple ball milling/thermal treatment procedure was applied to obtain fine thermistor powders. Three different powder compositions were analyzed–Cu0.2Ni0.5Zn1.0Mn1.3O4, Cu0.25Ni0.5Zn1.0Mn1.25O4 and Cu0.4Ni0.5Mn2.1O4. XRD analysis showed that all three powder compositions had a cubic spinel structure. Correlation between the sintering temperature, structure and resulting electrical properties was analyzed on bulk samples. Thick film pastes were composed and segmented thick film thermistors were screen printed on alumina, dried and fired. SEM analysis revealed a typical dendrite structure with small grains and a developed surface area. Thick film sheet resistance was measured on a test matrix and the resistance decreased with increasing Cu content. The temperature dependence of sample resistance was measured in a climatic chamber enabling calculation of the material constant and activation energy. Aging of the obtained segmented thermistors was analyzed and the resistivity drift was 0.23% for the Cu0.2Ni0.5Zn1.0Mn1.3O4 NTC thick film thermistor confirming greater stability of thermistors containing Zn and Cu that in combination with the determined good thermistor characteristics make them good candidates for temperature and heat loss sensor applications.
PB - Elsevier
T2 - Materials Science and Engineering: B
T1 - Preparation and characterization of Cu and Zn modified nickel manganite NTC powders and thick film thermistors
SP - 202
EP - 210
VL - 178
IS - 3
DO - 10.1016/j.mseb.2012.11.003
UR - https://hdl.handle.net/21.15107/rcub_dais_339
ER -
@article{
author = "Aleksić, Obrad S. and Nikolić, Maria Vesna and Luković, Miloljub D. and Nikolić, N. and Radojčić, B. M. and Radovanović, Milan and Đurić, Zorka Ž. and Mitrić, Miodrag and Nikolić, Pantelija M.",
year = "2013",
abstract = "A simple ball milling/thermal treatment procedure was applied to obtain fine thermistor powders. Three different powder compositions were analyzed–Cu0.2Ni0.5Zn1.0Mn1.3O4, Cu0.25Ni0.5Zn1.0Mn1.25O4 and Cu0.4Ni0.5Mn2.1O4. XRD analysis showed that all three powder compositions had a cubic spinel structure. Correlation between the sintering temperature, structure and resulting electrical properties was analyzed on bulk samples. Thick film pastes were composed and segmented thick film thermistors were screen printed on alumina, dried and fired. SEM analysis revealed a typical dendrite structure with small grains and a developed surface area. Thick film sheet resistance was measured on a test matrix and the resistance decreased with increasing Cu content. The temperature dependence of sample resistance was measured in a climatic chamber enabling calculation of the material constant and activation energy. Aging of the obtained segmented thermistors was analyzed and the resistivity drift was 0.23% for the Cu0.2Ni0.5Zn1.0Mn1.3O4 NTC thick film thermistor confirming greater stability of thermistors containing Zn and Cu that in combination with the determined good thermistor characteristics make them good candidates for temperature and heat loss sensor applications.",
publisher = "Elsevier",
journal = "Materials Science and Engineering: B",
title = "Preparation and characterization of Cu and Zn modified nickel manganite NTC powders and thick film thermistors",
pages = "202-210",
volume = "178",
number = "3",
doi = "10.1016/j.mseb.2012.11.003",
url = "https://hdl.handle.net/21.15107/rcub_dais_339"
}
Aleksić, O. S., Nikolić, M. V., Luković, M. D., Nikolić, N., Radojčić, B. M., Radovanović, M., Đurić, Z. Ž., Mitrić, M.,& Nikolić, P. M.. (2013). Preparation and characterization of Cu and Zn modified nickel manganite NTC powders and thick film thermistors. in Materials Science and Engineering: B
Elsevier., 178(3), 202-210.
https://doi.org/10.1016/j.mseb.2012.11.003
https://hdl.handle.net/21.15107/rcub_dais_339
Aleksić OS, Nikolić MV, Luković MD, Nikolić N, Radojčić BM, Radovanović M, Đurić ZŽ, Mitrić M, Nikolić PM. Preparation and characterization of Cu and Zn modified nickel manganite NTC powders and thick film thermistors. in Materials Science and Engineering: B. 2013;178(3):202-210.
doi:10.1016/j.mseb.2012.11.003
https://hdl.handle.net/21.15107/rcub_dais_339 .
Aleksić, Obrad S., Nikolić, Maria Vesna, Luković, Miloljub D., Nikolić, N., Radojčić, B. M., Radovanović, Milan, Đurić, Zorka Ž., Mitrić, Miodrag, Nikolić, Pantelija M., "Preparation and characterization of Cu and Zn modified nickel manganite NTC powders and thick film thermistors" in Materials Science and Engineering: B, 178, no. 3 (2013):202-210,
https://doi.org/10.1016/j.mseb.2012.11.003 .,
https://hdl.handle.net/21.15107/rcub_dais_339 .
