The electronic packaging and systems are very important topics as the limitation of miniaturization approaches in semiconductor industry. Regarding the optimal materials microstructure for these applications, we studied different alloys such as Sn-3.0Ag-0.5Cu (wt.%)/organic solderability preservative (SAC305/OSP) Cu and SAC305–0.05Ni/OSP Cu solder joints. We implemented the fractal dimension characterization and microstructure morphology reconstruction. This is the first time that we applied fractals on such alloys. The morphology reconstruction is important for predicting and designing the optimal microstructure for the advanced desirable properties these alloys. These analyzed parameters are important for the hand-held devices and systems especially for the exploitation. The fractal reconstruction was applied on the prepared microstructures with five different magnifications. The results confirmed successful application of fractals in this area of materials science considering the gr...ains and shapes reconstructions.
TY - JOUR
AU - Mitić, Vojislav V.
AU - Fleshman, Collin
AU - Duh, Jenq-Gong
AU - Ilić, Ivana D.
AU - Lazović, Goran
PY - 2021
UR - https://dais.sanu.ac.rs/123456789/12395
AB - The electronic packaging and systems are very important topics as the limitation of miniaturization approaches in semiconductor industry. Regarding the optimal materials microstructure for these applications, we studied different alloys such as Sn-3.0Ag-0.5Cu (wt.%)/organic solderability preservative (SAC305/OSP) Cu and SAC305–0.05Ni/OSP Cu solder joints. We implemented the fractal dimension characterization and microstructure morphology reconstruction. This is the first time that we applied fractals on such alloys. The morphology reconstruction is important for predicting and designing the optimal microstructure for the advanced desirable properties these alloys. These analyzed parameters are important for the hand-held devices and systems especially for the exploitation. The fractal reconstruction was applied on the prepared microstructures with five different magnifications. The results confirmed successful application of fractals in this area of materials science considering the grains and shapes reconstructions.
PB - World Scientific Pub Co Pte Ltd
T2 - Modern Physics Letters B
T1 - The fractal nature analysis by applying grain formations of SAC305/OSP Cu and SAC305-0.05Ni/OSP Cu solder joints for microelectronic packaging
VL - 35
IS - 33
DO - 10.1142/S0217984921504273
UR - https://hdl.handle.net/21.15107/rcub_dais_12395
ER -
@article{
author = "Mitić, Vojislav V. and Fleshman, Collin and Duh, Jenq-Gong and Ilić, Ivana D. and Lazović, Goran",
year = "2021",
abstract = "The electronic packaging and systems are very important topics as the limitation of miniaturization approaches in semiconductor industry. Regarding the optimal materials microstructure for these applications, we studied different alloys such as Sn-3.0Ag-0.5Cu (wt.%)/organic solderability preservative (SAC305/OSP) Cu and SAC305–0.05Ni/OSP Cu solder joints. We implemented the fractal dimension characterization and microstructure morphology reconstruction. This is the first time that we applied fractals on such alloys. The morphology reconstruction is important for predicting and designing the optimal microstructure for the advanced desirable properties these alloys. These analyzed parameters are important for the hand-held devices and systems especially for the exploitation. The fractal reconstruction was applied on the prepared microstructures with five different magnifications. The results confirmed successful application of fractals in this area of materials science considering the grains and shapes reconstructions.",
publisher = "World Scientific Pub Co Pte Ltd",
journal = "Modern Physics Letters B",
title = "The fractal nature analysis by applying grain formations of SAC305/OSP Cu and SAC305-0.05Ni/OSP Cu solder joints for microelectronic packaging",
volume = "35",
number = "33",
doi = "10.1142/S0217984921504273",
url = "https://hdl.handle.net/21.15107/rcub_dais_12395"
}
Mitić, V. V., Fleshman, C., Duh, J., Ilić, I. D.,& Lazović, G.. (2021). The fractal nature analysis by applying grain formations of SAC305/OSP Cu and SAC305-0.05Ni/OSP Cu solder joints for microelectronic packaging. in Modern Physics Letters B
World Scientific Pub Co Pte Ltd., 35(33).
https://doi.org/10.1142/S0217984921504273
https://hdl.handle.net/21.15107/rcub_dais_12395
Mitić VV, Fleshman C, Duh J, Ilić ID, Lazović G. The fractal nature analysis by applying grain formations of SAC305/OSP Cu and SAC305-0.05Ni/OSP Cu solder joints for microelectronic packaging. in Modern Physics Letters B. 2021;35(33).
doi:10.1142/S0217984921504273
https://hdl.handle.net/21.15107/rcub_dais_12395 .
Mitić, Vojislav V., Fleshman, Collin, Duh, Jenq-Gong, Ilić, Ivana D., Lazović, Goran, "The fractal nature analysis by applying grain formations of SAC305/OSP Cu and SAC305-0.05Ni/OSP Cu solder joints for microelectronic packaging" in Modern Physics Letters B, 35, no. 33 (2021),
https://doi.org/10.1142/S0217984921504273 .,
https://hdl.handle.net/21.15107/rcub_dais_12395 .
