TY  - JOUR
AU  - Jović, Vladimir D.
AU  - Spaić, Savo
AU  - Despić, Aleksandar R.
AU  - Stevanović, Jasmina S.
AU  - Pristavec, Matjaž
PY  - 1991
UR  - https://dais.sanu.ac.rs/123456789/11649
AB  - An attempt was made to analyse the phase structure of thin layers of electrodeposited Cu–Cd alloys using anodic linear sweep voltammetry combined with a potentiostatic pulse technique (ALSV–PPT). The results were compared with data obtained using conventional techniques for phase structure analysis. It was found that application of the conventional X-ray technique (Guinier analysis) is limited, because the grain size of the alloy constituents is too small for compounds to be revealed by X-ray peaks. Electrodeposited alloys could be successfully analysed using that method only after subsequent thermal treatment. Diffraction patterns from transmission electron micrographs of very thin foils (of the order of 20–50 nm) of electrodeposited 75Cd–25Cu (at.-%) alloy revealed the presence of CuCd3 intermetallic compound having a grain size of ~20 nm. By comparing all the results, the distribution of the various intermetallic compounds present at various stages in the electrodeposition of thin (up to 10 μm) layers of Cu–Cd alloys could be established. Combined ALSV–PPT was found to be more sensitive than either of the other methods employed. MST/1206.
PB  - Taylor & Francis INC
T2  - Materials Science and Technology
T1  - Identification of intermetallic compounds in thin layers of electrodeposited Cu–Cd alloys using electrochemical techniques
SP  - 1021
EP  - 1030
VL  - 7
IS  - 11
DO  - 10.1179/mst.1991.7.11.1021
UR  - https://hdl.handle.net/21.15107/rcub_dais_11649
ER  - 

@article{
author = "Jović, Vladimir D. and Spaić, Savo and Despić, Aleksandar R. and Stevanović, Jasmina S. and Pristavec, Matjaž",
year = "1991",
abstract = "An attempt was made to analyse the phase structure of thin layers of electrodeposited Cu–Cd alloys using anodic linear sweep voltammetry combined with a potentiostatic pulse technique (ALSV–PPT). The results were compared with data obtained using conventional techniques for phase structure analysis. It was found that application of the conventional X-ray technique (Guinier analysis) is limited, because the grain size of the alloy constituents is too small for compounds to be revealed by X-ray peaks. Electrodeposited alloys could be successfully analysed using that method only after subsequent thermal treatment. Diffraction patterns from transmission electron micrographs of very thin foils (of the order of 20–50 nm) of electrodeposited 75Cd–25Cu (at.-%) alloy revealed the presence of CuCd3 intermetallic compound having a grain size of ~20 nm. By comparing all the results, the distribution of the various intermetallic compounds present at various stages in the electrodeposition of thin (up to 10 μm) layers of Cu–Cd alloys could be established. Combined ALSV–PPT was found to be more sensitive than either of the other methods employed. MST/1206.",
publisher = "Taylor & Francis INC",
journal = "Materials Science and Technology",
title = "Identification of intermetallic compounds in thin layers of electrodeposited Cu–Cd alloys using electrochemical techniques",
pages = "1021-1030",
volume = "7",
number = "11",
doi = "10.1179/mst.1991.7.11.1021",
url = "https://hdl.handle.net/21.15107/rcub_dais_11649"
}

Jović, V. D., Spaić, S., Despić, A. R., Stevanović, J. S.,& Pristavec, M.. (1991). Identification of intermetallic compounds in thin layers of electrodeposited Cu–Cd alloys using electrochemical techniques. in Materials Science and Technology
Taylor & Francis INC., 7(11), 1021-1030.
https://doi.org/10.1179/mst.1991.7.11.1021
https://hdl.handle.net/21.15107/rcub_dais_11649

Jović VD, Spaić S, Despić AR, Stevanović JS, Pristavec M. Identification of intermetallic compounds in thin layers of electrodeposited Cu–Cd alloys using electrochemical techniques. in Materials Science and Technology. 1991;7(11):1021-1030.
doi:10.1179/mst.1991.7.11.1021
https://hdl.handle.net/21.15107/rcub_dais_11649 .

Jović, Vladimir D., Spaić, Savo, Despić, Aleksandar R., Stevanović, Jasmina S., Pristavec, Matjaž, "Identification of intermetallic compounds in thin layers of electrodeposited Cu–Cd alloys using electrochemical techniques" in Materials Science and Technology, 7, no. 11 (1991):1021-1030,
https://doi.org/10.1179/mst.1991.7.11.1021 .,
https://hdl.handle.net/21.15107/rcub_dais_11649 .