Претраживање
Приказ резултата 1-6 од 6
The Influence of Temperature on Microstructure Contact Surfaces on BaTiO3 –ceramics Doped with Ho2O3
(Belgrade : Serbian Ceramic Society, 2014)
The materials based on BaTiO3 can be controlled using different technological parameters and different additives. We investigate the influence of different temperature levels of sintering (1320°C, 1350°C and 1380°C) on the ...
The Fractal Nature Grains Shape Reconstruction on the Way to Microstructure Prognosis
(Belgrade : Serbian Ceramic Society, 2014)
The structure of BaTiO3 based ceramics materials, can be controlled by using different pressing pressures, sintering temperatures and different additive concentrations. In this paper, microstructure properties of Ho2O3 ...
Microstructure Samples Preparation and Analysis on the Way for Statistical and Fractals Applications
(Belgrade : Serbian Ceramic Society, 2014)
The new correlation between microstructure and dielectric properties of doped BaTiO3-ceramics based on fractal geometry and contact surface probability has been developed. The doped BaTiO3-ceramics using in this investigation ...
Microstructure and EDS Contact Surfaces Characterization for Statistical Analysis of Doped BaTiO3-Ceramics
(Belgrade : Serbian Ceramic Society, 2012)
Barium-titanate based ceramics belongs to one of very important group of functional ceramics that can be used on a large scale of applications. The properties of BaTiO3 based ceramics are fundamentally correlated with grain ...
Ho2O3 Additive Effects on Microstructure and Dielectrical Properties of BaTiO3 Ceramics
(Belgrade : Serbian Ceramic Society, 2012)
Doped BaTiO3-ceramics is very interesting for its application as resistors with PTCR, multilayer ceramics capacitors, thermal sensors etc. Ho doped BaTiO3 ceramics, with different Ho2O3 content, ranging from 0.01 to 1.0 ...
New Frontiers: Miniaturization and Higher Level BaTiO3 -Ceramics Microelectronics Circuits Integration
(Belgrade : Serbian Ceramic Society, 2012)
Since that the scientific and technological efforts to further miniaturization, "better packaging" and higher levels of integration of electronic components and subsystems, and modern microelectronics devices are increasingly ...