dc.creator | Lukić, Miodrag J. | |
dc.creator | Jovalekić, Čedomir | |
dc.creator | Marković, Smilja | |
dc.creator | Uskoković, Dragan | |
dc.date.accessioned | 2018-07-25T13:36:40Z | |
dc.date.available | 2018-07-25T13:36:40Z | |
dc.date.issued | 2015 | |
dc.identifier.issn | 0025-5408 | |
dc.identifier.uri | https://dais.sanu.ac.rs/123456789/3548 | |
dc.description.abstract | Correlation between high-temperature electrical response and microstructural properties of dense hydroxyapatite with average grain size from micrometer to nanometer level in heating/cooling cycle was investigated. Grain interior and grain boundary contributions to overall conductivity were determined. Nanostructured hydroxyapatite exhibited enhanced grain interior conductivity, with significantly higher activation energy (∼2.4 eV) than that of coarsed microstructures (∼1.7 eV). This difference in activation energies is explained by the possible influence of dehydroxylation during materials fabrication procedure, which affected the amount of OH- ions as the main charge carriers. Grain boundary conductivity was similar for all microstructures, with activation energy above ∼2 eV, implying the OH- ions migration across grain boundaries. Electrical response in cooling cycle confirmed the trends found during heating. © 2014 Elsevier B.V. All rights reserved. | en |
dc.publisher | Elsevier | |
dc.relation | info:eu-repo/grantAgreement/MESTD/Integrated and Interdisciplinary Research (IIR or III)/45004/RS// | |
dc.rights | restrictedAccess | |
dc.source | Materials Research Bulletin | |
dc.title | Enhanced high-temperature electrical response of hydroxyapatite upon grain size refinement | en |
dc.type | article | en |
dc.rights.license | ARR | |
dcterms.abstract | Ускоковић, Драган; Лукић, Миодраг Ј.; Јовалекић, Чедомир; Марковић, Смиља; | |
dc.citation.spage | 534 | |
dc.citation.epage | 538 | |
dc.citation.volume | 61 | |
dc.identifier.wos | 000347498700084 | |
dc.identifier.doi | 10.1016/j.materresbull.2014.10.072 | |
dc.identifier.scopus | 2-s2.0-84909644161 | |
dc.type.version | publishedVersion | |
dc.identifier.rcub | https://hdl.handle.net/21.15107/rcub_dais_3548 | |